APPLIED ELECTROLESS CONCEPTS
TECHNICAL PRESENTATIONS OF DR.KRULIK

This is a partial listing which highlights only some of the more
public talks.

BIBLIOGRAPHY OF PRESENTATIONS OF Dr. GERALD KRULIK

44. Pretreatment Techniques for CMP Water Recycling With Integration of EnChem
Treated Wastewaters, WATERTECH 2001, Portland, Ore, Dec. 4-5. 2001.

43. Recycle Integration of EnChem Treated Wastewaters. July 11. Water: Recycling and
Alternate Sources for the Wafer/PCB Industries. Singapore. July 11-12, 2001.

42. Copper CMP Wastewater Chemistry and Treatment, Ultrapure Water 2000,
Singapore, October 4, 2000.

41. Removal of Arsenic and Fluoride from GaAs Wastewaters, Ultrapure Water 2000,
Singapore, October 3, 2000.

40. Numerous talks world wide on the EnChem waste treatment system, 1999-2001.

39. Numerous talks world wide on the EPOC waste treatment process, 1997-1998.

38. J.Adams, K.Holland, T.Bibby, G.Krulik, J.Lee, P.Parikj, CMP Slurry Re-Processing,
presented at CMCTF, San Diego, April 1997, accepted for publication in Thin Solid Films.

37. “Simple Waste Treatment of Silica and Metals CMP”, at Semicon Europa, Geneva,
Switzerland, April 17, 1997.

36. “CMP Slurry Reprocessing”, at Semicon Korea, Seoul, Korea, January, 1997.

35. “Demonstration Projects in Plating and Printed Circuit Waste Reduction”, at
conference HAZMACON’93, San Jose Convention Center, April 6, 1993.

34. “Fluoride & Boron-Free Strippers for Printed Circuit Boards”, at conference Pollution
Prevention: Towards 2000, Los Angeles Biltmore Hotel, July 31, 1991.

33. Two talks in Taipai, Taiwan, on RFI shielding and application methods, July 8 and 10,
1991.

32. Instititute of Printed Circuits Spring Meeting, “A New Method for Treatment of Spent
Photoresist Stripper”, Phoenix, Arizona, April 15, 1991.

31. Videotape, “The Advantage 2000 System For Photoresist Stripper Waste Treatment.”
Dynachem Corp, January, 1991.

30. Technology For Today Technical Symposium. “Substitution of Hazardous For Non-
hazardous Process Chemicals in the Printed Circuit Industry”, May 22, 1989, Los
Angeles, California.

29. American Electroplaters Society Northeast Regional Meeting. “Effects of Aqueous
Photoresist on Sn/Pb Plating Baths”, Krulik, G.A., W.Wachal and A.Laurano, March 13,
1988.

28. Irvine Valley College Printed Circuit Board Seminar Series. “New Perspectives in
Smear Removal”, December 12, 1987 and January,1988.

27. Technical Seminar. “The CDE-1000 Process”, September 14, 1988, Tustin, Ca, and
September 16, 1988, San Fernando Valley, Ca.

26. Institute of Printed Circuits Fall Meeting. “Regeneration of Permanganate Etchants”,
October 5, 1987, Chicago, Illinois.

25. “The Copperstat Process: A New Concept For Electroless Copper Bath Purification
and Control”, and “The Dynachem CDE-1000 Chemical Desmear/Etchback System”,
November 18, 1985, Manchester, England; November 19, Paris; November 20, Belgium;
November 21-22, West Germany.

24. Videotape (30 minutes). “The Dynachem CDE-1000 Chemical Desmear/Etchback
Process”, distributed to all Dynachem sales managers for field use, September, 1985.

23. Technical Seminar at Dynachem, Tustin. “Electroless Copper-The Solution to the
Newest Pollution”.

22. AMERICAN SOCIETY FOR ELECTROPLATED PLASTICS 1-day seminar on
electroless plating for RFI shielding. “Composite Electroless Coatings for EMI/RFI
Shielding”, February 1, 1984, Boston, Massachussetts, and April 25, 1984, Anaheim,
California.

21. The following has been given approximately 25 times during 1984-5 in the US from
Seattle, Washington to West Haven, Connecticut, and in Japan, November 13-17, 1984.
“Plated Plastics for EMI/RFI Shielding: A Review of Standards, Economics, Processes,
and Test Methods”.

20. Institute of Metal Finishing 1984 Annual Conference. “Electroless Plating For RFI
Shielding”, May 5, 1984, Eastbourne, England.

19. American Society for Electroplated Plastics 1-day seminar ‘A Practical Approach:
Electroless Plating of Plastics’, “Composite Electroless Coatings for EMI/RFI Shielding”,
October 20, 1983, Monterey, California.

18.        American Society for Electroplated Plastics 16th Annual Convention. “Newest
Developments in Electroless Coppers”, October 19, 1983, Monterey, California.

17.        American Electroplaters Society Annual Convention. “Performance of Electroless
Deposits for EMI/RFI Shielding”, (co-author J.Waggoner) June 29, 1983, Indianapolis,
Indiana; 70th, H-2, 21 pp.

16. IBM Corporation invited talk. “Catalysts for Electroless Plating”, June 1-2, 1983,
Endicott & Owego, New York.

15.        American Electroplaters Society Rockford Section Monthly Meeting. “Hydrogen
Embrittlement”, January 10, 1983, Rockford, Illinois.

14.        1st Annual Painting & Plating Expo. “The Growing Popularity of Electroless
Nickel”, November 16, 1982, Rosemont, Illinois.

13. American Society for Electroplated Plastics - 15th Annual Convention. “New
Electroless Copper for Plating on Plastics”, October 20, 1982, Kiawah Island, South
Carolina.

12. AMERICAN ELECTROPLATERS SOCIETY Chicago Section Monthly Meeting.
“Electroless Nickel - Practical Applications”, November 12, 1981, Chicago, Illinois.

11. AMERICAN ELECTROPLATERS SOCIETY Technical  Seminar on Printed Circuits and
Plating. “Electroless Nickel - Practical Applications”, November 6, 1981, Iowa City, Iowa.

10. AMERICAN SOCIETY FOR ELECTROPLATED PLASTICS - 14th Annual Convention.
“The Metaliminator - A New Concept in Waste Treatment”, October 28, 1981, Palm
Springs, California.

9. AMERICAN SOCIETY FOR ELECTROPLATED PLASTICS - 13th Annual Convention.
“The Evolution of a Process: 35 Years of Electroless Nickel”, October,1980, Tarpon
Springs, Florida.

8. AMERICAN ELECTROPLATERS SOCIETY Midwest Regional Seminar, “Dry Catalyst
and Its Use in Catalyzation of Printed Circuits”, October 28, 1977,Minneapolis,
Minnessota.

7. Invited Lecture. “Electroless Technology for Plating Non-Conductors”, July 1, 1977,
Brigham Young University, Provo, Utah.

6. Printed Circuitry and Plating for Electronics Workshop. “Cost-Effective Catalysis for
Printed Circuits”, April 21, 1977, Valley Forge, Pennsylvania.

5. 6th Annual Printed Circuit Workshop, Merrimac Valley Branch, AMERICAN
ELECTROPLATERS SOCIETY. “Cost-Effective Catalysis for Printed Circuits”, March 10,
1977, Danvers, Massachusetts.

4. American Electroplaters (AES)/American Electrochemical Society joint meeting. “A
Close-up View of Plastics Plating”, October 8, 1976, Chicago, Illinois.

3. AMERICAN ELECTROPLATERS SOCIETY - Annual Convention. “The Catalytic
Process in Electroless Plating”, June 30, 1976, Denver, Colorado.

2. American Chemical Society - Marietta Section. “Plating of Plastics - The Catalyst is the
Key”, March 17, 1976, Marietta, Ohio.

1. AMERICAN SOCIETY FOR ELECTROPLATED PLASTICS - 8th Annual Convention.
“DRI-CAT 3 - A New Approach”, November 14, 1975, Palm Springs, California.
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